HIC-764-SST related parameters_HIC-764-SST PDF documentation_Samtec Inc.

Sockets for ICs Transistors

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Specifications

Description	Details
Series	HIC
Package	Tube
Type	DIP, 0.75" (19.05mm) Row Spacing
Number of Positions or Pins (Grid)	64 (2 x 32)
Pitch - Mating	0.070" (1.78mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.070" (1.78mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Brass
Housing Material	Polyester, Glass Filled
Operating Temperature	-

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