0475960532 related parameters_0475960532 PDF documentation_Molex

Sockets for ICs Transistors

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Specifications

Description	Details
Series	47596
Package	Tray
Type	LGA
Number of Positions or Pins (Grid)	1156 (40 x 40)
Pitch - Mating	0.036" (0.91mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	15.0µin (0.38µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Surface Mount
Features	Closed Frame
Termination	Solder
Pitch - Post	0.036" (0.91mm)
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	-
Housing Material	Thermoplastic
Operating Temperature	-

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