28-3574-10 related parameters_28-3574-10 PDF documentation_Aries Electronics

Sockets for ICs Transistors

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Specifications

Description	Details
Series	57
Package	Bulk
Type	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	-

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