520-AG10D-ES related parameters_520-AG10D-ES PDF documentation_TE Connectivity AMP Connectors

Sockets for ICs Transistors

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Specifications

Description	Details
Series	500
Package	Bulk
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	20 (2 x 10)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	Brass
Housing Material	-
Operating Temperature	-55°C ~ 125°C

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