WB3F200VD1 related parameters_WB3F200VD1 PDF documentation_JAE Electronics

Rectangular Connectors - Arrays

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Specifications

Description	Details
Series	WB3
Package	Tray
Connector Type	Receptacle, Center Strip Contacts
Number of Positions	200
Pitch	0.020" (0.50mm)
Number of Rows	2
Mounting Type	Surface Mount
Features	Board Guide, Solder Retention
Contact Finish	Gold
Contact Finish Thickness	30.0µin (0.76µm)
Mated Stacking Heights	4mm, 5mm
Height Above Board	0.098" (2.50mm)

Other

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